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Molding Processing Service - Company Ranking(45 companies in total)

Last Updated: Aggregation Period:Dec 17, 2025〜Jan 13, 2026
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Company Name Featured Products
Product Image, Product Name, Price Range overview Application/Performance example
【Overview】 ■Base resin: Epoxy resin mixture + hardener ■Filler: Magnetic powder (amorphous) ■Other components: Wax, etc. ■Product form: Powd... For more details, please refer to the PDF document or feel free to contact us.
【Other Features】 ■TM-250  ・High fluidity, flame retardant ■TM-261  ・High fluidity, low shrinkage, low thermal expansion, flame retardant ■YD... 【Applications】 ■ Optical communication components ■ Precision mechanism components ■ Pickup components ■ Various insulators *For more detai...
【Other Features】 ■Curing Properties  ・Can be demolded at 120℃ in 3 minutes ■Flexural Strength  ・170 MPa ■Flexural Modulus  ・20 GPa ■Spiral F... 【Applications】 ■ Sealing of two-wheeled vehicle ECUs ■ Bulk sealing of mounted circuit boards ■ Sealing of capacitors *For more details, pl...
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  1. Featured Products
    Epoxy resin molding material "OR-40 Magnetic Property Improved Grade"Epoxy resin molding material "OR-40 Magnetic Property Improved Grade"
    overview
    【Overview】 ■Base resin: Epoxy resin mixture + hardener ■Filler: Magnetic powder (amorphous) ■Other components: Wax, etc. ■Product form: Powd...
    Application/Performance example
    For more details, please refer to the PDF document or feel free to contact us.
    Injection molding epoxy resin material "TM-250"Injection molding epoxy resin material "TM-250"
    overview
    【Other Features】 ■TM-250  ・High fluidity, flame retardant ■TM-261  ・High fluidity, low shrinkage, low thermal expansion, flame retardant ■YD...
    Application/Performance example
    【Applications】 ■ Optical communication components ■ Precision mechanism components ■ Pickup components ■ Various insulators *For more detai...
    Low-temperature low-pressure molding epoxy resin molding material "KT-17 C20"Low-temperature low-pressure molding epoxy resin molding material "KT-17 C20"
    overview
    【Other Features】 ■Curing Properties  ・Can be demolded at 120℃ in 3 minutes ■Flexural Strength  ・170 MPa ■Flexural Modulus  ・20 GPa ■Spiral F...
    Application/Performance example
    【Applications】 ■ Sealing of two-wheeled vehicle ECUs ■ Bulk sealing of mounted circuit boards ■ Sealing of capacitors *For more details, pl...